New semiconductor materials for smaller and more powerful devices

EU-funded scientists successfully developed a novel approach for integrating III-V compound semiconductor materials on silicon (Si) wafers. This is an important achievement on the road to making chips smaller and more powerful at low power density.

The ongoing impact of Moore’s law has been driving advances in computing devices as they keep getting smaller, faster and cheaper. Thus, the semiconductor industry is facing the challenge of how to migrate processes that were once developed for some few microns to be able to form junctions that are a few nanometres in scale.

Further details: New semiconductor materials for smaller and more powerful devices